Novel Packaging with Rematable Spring Interconnect Chips for MCMs
Novel Packaging with Rematable Spring Interconnect Chips for MCMs
01 May 2009
IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.
Venue : N/A
01 May 2009
IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.
Venue : N/A