Proximity interconnect flip-chip package with micron chip-to-chip alignment tolerances
Proximity interconnect flip-chip package with micron chip-to-chip alignment tolerances
T. Sze, M. Giere, B. Guenin, N. Nettleton, D. Popovic, R. Drost, R. Hopkins, R. Ho, S. Bezuk
01 May 2009
IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.
Venue : N/A