BGA package co-integration of electrical, optical, and capacitive interconnects
BGA package co-integration of electrical, optical, and capacitive interconnects
X. Zheng, J. Lexau, J. Cunningham, A. Krishnamoorthy, D. Rolston, R. Ho
01 May 2009
IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.
Venue : N/A