Clocking links in multi-chip packages: a case study
Clocking links in multi-chip packages: a case study
T. Ali, D. Patil, F. Liu, E. Alon, J. Lexau, C.-K. K. Yang, R. Ho
01 August 2010
18th Annual IEEE Symposium on High Performance Interconnects, August 2010.
Venue : N/A