Proximity interconnect flip-chip package with micron chip-to-chip alignment tolerances

Proximity interconnect flip-chip package with micron chip-to-chip alignment tolerances

T. Sze, M. Giere, B. Guenin, N. Nettleton, D. Popovic, R. Drost, R. Hopkins, R. Ho, S. Bezuk

01 May 2009

IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.


Venue : N/A