BGA package co-integration of electrical, optical, and capacitive interconnects

BGA package co-integration of electrical, optical, and capacitive interconnects

X. Zheng, J. Lexau, J. Cunningham, A. Krishnamoorthy, D. Rolston, R. Ho

01 May 2009

IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.


Venue : N/A