Clocking links in multi-chip packages: a case study

Clocking links in multi-chip packages: a case study

T. Ali, D. Patil, F. Liu, E. Alon, J. Lexau, C.-K. K. Yang, R. Ho

01 August 2010

18th Annual IEEE Symposium on High Performance Interconnects, August 2010.


Venue : N/A