Novel Packaging with Rematable Spring Interconnect Chips for MCMs

Novel Packaging with Rematable Spring Interconnect Chips for MCMs

I. Shubin, E.M. Chow, J. Cunningham, D. DeBruyker, C. Chua, B. Cheng, J. Knights, K. Sahasrabuddhe, Y. Luo, A. Chow, J. Simons, A. Krishnamoorthy, R. Hopkins, R. Drost, R. Ho, D. Douglas, J. Mitchell

01 May 2009

IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.


Venue : N/A