“Dual-Purpose” Remateable Conductive Ball-in-Pit Interconnects for Chip Powering and Passive Alignment in Proximity Communication Enabled Multi-Chip Packages
“Dual-Purpose” Remateable Conductive Ball-in-Pit Interconnects for Chip Powering and Passive Alignment in Proximity Communication Enabled Multi-Chip Packages
Hiren Thacker, Ivan Shubin, Ying Luo, Kannan Raj, Ashok Krishnamoorthy, Jack Cunningham
14 February 2012
with Hiren Thacker, Ivan Shubin, Ying Luo, Kannan Raj, Ashok Krishnamoorthy and John Cunningham
Venue : N/A