Integration and packaging of a macrochip with silicon nanophotonic links
J. Cunningham, A. Krishnamoorthy, R. Ho, H. Thacker, I. Shubin, J. Lexau, D. Lee, D. Feng, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, J. Mitchell
01 December 2011
in press, IEEE Journal of Selected Topics in Quantum Electronics, special issue on Packaging and Integration technologies for Optical MEMS/NEMS, Optoelectronic and Nanophotonic Devices, 2011.
Venue : N/A