01 July 2016
This paper demonstrates a new approach to model the impact of thermal effects on the efficiency of integrated voltage regulators (IVRs) by combining analytical efficiency evaluations with coupled electrical and thermal simulations. An application of the approach shows that a system-in-package solution avoids thermal problems typically observed in other IVR
designs. While the evaluation in this paper focuses on the thermal impact on loss in the inductor wiring and the PDN, the developed approach is general enough to also model thermal impacts on the power dissipation in the inductor cores and the buck converter chip.
Venue : IEEE Conf. on Electrical Performance of Electronics Packaging and Systems (EPEPS)