Novel Packaging with Rematable Spring Interconnect Chips for MCMs
I. Shubin, E.M. Chow, J. Cunningham, D. DeBruyker, C. Chua, B. Cheng, J. Knights, K. Sahasrabuddhe, Y. Luo, A. Chow, J. Simons, A. Krishnamoorthy, R. Hopkins, R. Drost, R. Ho, D. Douglas, J. Mitchell
01 May 2009
IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.
Venue : N/A