Microelectronics Packaging for Photonics and Multi-Chip Modules (part 2 of 2)

Project

Microelectronics Packaging for Photonics and Multi-Chip Modules (part 2 of 2)

Principal Investigator

Muhannad Bakir, Muhannad Bakir

Georgia Institute of Technology

Oracle Principal Investigator

David Hopkins, Director, VLSI Research
Michael Dayringer, Principal Member of Technical Staff

Summary

Professor M. Bakir and his graduate students at Georgia Tech are developing technologies to enable the precise alignment of chips in a multi-chip package using remateable microsprings to connect chips in a package to the package substrate to enable replacement during testing of the complete package and for long term reliability of the chip to package connections. These technologies would enable a variety of different chips to be co-packaged, such as processors, DRAMs, or silicon photonics elements.