Microelectronics Packaging for Photonics and Multi-Chip Modules (part 2 of 2)
Muhannad Bakir, Muhannad Bakir
Georgia Institute of Technology
Professor M. Bakir and his graduate students at Georgia Tech are developing technologies to enable the precise alignment of chips in a multi-chip package using remateable microsprings to connect chips in a package to the package substrate to enable replacement during testing of the complete package and for long term reliability of the chip to package connections. These technologies would enable a variety of different chips to be co-packaged, such as processors, DRAMs, or silicon photonics elements.