Conference Publication

Novel Packaging with Rematable Spring Interconnect Chips for MCMs
May 2009

IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.

Authors: I. Shubin, E.M. Chow, J. Cunningham, D. DeBruyker, C. Chua, B. Cheng, J. Knights, K. Sahasrabuddhe, Y. Luo, A. Chow, J. Simons, A. Krishnamoorthy, R. Hopkins, R. Drost, R. Ho, D. Douglas, J. Mitchell


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