Conference Publication

Proximity interconnect flip-chip package with micron chip-to-chip alignment tolerances
May 2009

IEEE Electronic Components and Technology Conference (ECTC2009), May 2009.

Authors: T. Sze, M. Giere, B. Guenin, N. Nettleton, D. Popovic, R. Drost, R. Hopkins, R. Ho, S. Bezuk


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